Magnesium (Mg) Sputtering Targets
Purity: 99.95%, Size: 8”, Thickness: 0.250”
Magnesium (Mg) sputtering targets are designed for depositing thin films from a wide variety of materials onto substrates of different shapes and sizes. The sputtering process is repeatable and can be scaled from small research applications to medium- and large-scale production batches. Depending on process parameters, chemical reactions may occur on the target surface, during particle flight, or on the substrate. While sputter deposition is complex, it provides experts with precise control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for thin-film deposition, where material is eroded from a “target” and deposited onto a substrate such as a silicon wafer.
In semiconductor manufacturing, sputter etching is applied when high anisotropy is needed and selectivity is not critical.
Targets are also used for analytical purposes by etching away the target material.
A key example is secondary ion mass spectroscopy (SIMS), where the sample is sputtered at a constant rate and the ejected atoms are analyzed using mass spectrometry. This allows determination of target composition and detection of extremely low concentrations of impurities.
Sputtering also has applications in space, contributing to space weathering—a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
