Magnesium (Mg) Sputtering Targets
Purity: 99.98%, Size: 8”, Thickness: 0.250”
Magnesium (Mg) sputtering targets are used for depositing thin films from a wide range of materials onto substrates of various shapes and sizes. Sputtering is a reliable and repeatable process that can be scaled from small research applications to medium- or large-scale production batches. Depending on process parameters, chemical reactions may occur on the target surface, during particle flight, or directly on the substrate. Although sputter deposition is complex, it provides precise control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for thin-film deposition, where material is eroded from a “target” and deposited onto a substrate such as a silicon wafer.
In semiconductor manufacturing, sputter etching is applied when high anisotropy is required and selectivity is not critical.
Targets are also used for analytical purposes by removing surface material.
A key example is secondary ion mass spectroscopy (SIMS), in which the target is sputtered at a constant rate and the ejected atoms are analyzed using mass spectrometry. This allows determination of material composition and detection of trace impurities.
Sputtering also has space applications. It contributes to space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
