Titanium Boride (TiB2) Sputtering Targets
Purity: 99.5%, Size: 4”, Thickness: 0.250”
Sputtering is a proven technology used to deposit thin films from a wide variety of materials onto substrates of different shapes and sizes.
The process using sputter targets is repeatable and can be scaled up from small research and development projects.
The process with sputter targets can also be adapted for production batches involving medium to large substrate areas.
Chemical reactions may occur on the target surface, in-flight, or on the substrate depending on the process parameters.
Although many parameters make sputter deposition a complex process, they also provide experts with significant control over the growth and microstructure of the deposited film.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. The deposition performed with sputter targets involves creating thin films by sputtering, which erodes material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching. Sputter etching is selected when a high degree of etching anisotropy is required and selectivity is not a primary concern.
Sputter targets are also used for analysis by gradually etching away the target material.
One example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As erosion progresses, the concentration and identity of sputtered atoms are analyzed using mass spectrometry. With the help of the sputtering target, the composition of the material can be determined, and extremely low impurity concentrations can be detected.
Sputtering targets also have applications in space. Sputtering is one of the processes involved in space weathering, which alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
