Titanium Carbide (TiC) Sputtering Targets
Purity: 99.5%, Size: 2”, Thickness: 0.125”
Sputtering is a proven technology used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to larger applications.
The process with sputter targets can also be adapted for production batches involving medium to large substrate areas.
Chemical reactions may occur on the target surface, during material transfer, or on the substrate depending on the process parameters.
Although many parameters make sputter deposition a complex process, they also provide experts with significant control over the growth and microstructure of the deposited film.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. The deposition performed with sputter targets is a method of creating thin films by eroding material from a “target” source and transferring it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching. Sputter etching is selected when a high level of etching anisotropy is required and selectivity is not a primary concern.
Sputter targets are also used for analytical purposes by etching away the target material.
One example occurs in secondary ion spectroscopy (SIMS), where the sample is sputtered at a constant rate. As the target surface is eroded, the concentration and identity of sputtered atoms are measured using mass spectrometry. With the aid of the sputtering target, the composition of the material can be determined, and extremely low impurity concentrations can be detected.
Sputtering targets also have applications in space. Sputtering is one of the mechanisms involved in space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
