Iron Oxide (Fe3O4) Sputtering Targets
Purity: 99.9%, Size: 6”, Thickness: 0.250”
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto diverse substrate shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. The chemical reaction can occur on the target surface, in-flight, or on the substrate depending on the process parameters. These numerous parameters make sputter deposition a complex process but provide experts with a high degree of control over the growth and microstructure of the deposited film.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. The deposition achieved with sputter targets is a method of depositing thin films by sputtering, which involves eroding material from a “target” source onto a “substrate” such as a silicon wafer.
Semiconductor sputtering targets are used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
Sputter targets are also used for analysis by etching away the target material.
One example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. Using the sputtering target, the composition of the target material can be determined, and even extremely low concentrations of impurities can be detected.
Sputtering targets also have applications in space. Sputtering is one form of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.
