Iron (Fe) Sputtering Targets
Purity: 99.9%, Size: 2”, Thickness: 0.125”
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto diverse substrate shapes and sizes.
The process using sputter targets is repeatable and can be scaled up from small research and development projects. The process with sputter
targets can be adapted for production batches involving medium to large substrate areas. Depending on the process parameters, chemical
reactions may occur on the target surface, in-flight, or on the substrate. The many parameters involved make sputter deposition a complex
process, but they also provide experts with significant control over the growth and microstructure of the deposited area.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering
that involves eroding material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used to etch the target. Sputter etching is selected in cases where a high degree of etching anisotropy
is required and selectivity is not a concern.
Sputter targets are also used for analysis by etching away the target material.
One example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered,
the concentration and identity of sputtered atoms are measured using mass spectrometry. With the support of the sputtering target, the
composition of the target material can be determined, and even extremely low concentrations of impurities can be detected.
Sputtering targets also have application areas in space. Sputtering is one of the forms of space weathering, a process that alters the physical
and chemical properties of airless bodies, such as asteroids and the Moon.
