Titanium Carbide (TiC) Sputtering Targets
Purity: 99.5%, Size: 4”, Thickness: 0.125”
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto substrates of diverse shapes and sizes.
The process involving sputter targets is repeatable and can be scaled from small research and development projects to larger production operations.
The process with sputter targets can also be adapted for production batches involving medium to large substrate areas. Depending on the process parameters,
chemical reactions may occur on the target surface, in-flight, or on the substrate. Although sputter deposition involves many variables,
this complexity provides experts with a high degree of control over the growth and microstructure of the deposited layer.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. The deposition produced by sputter targets is a method of creating thin films through sputtering,
which involves eroding material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used to etch the target. Sputter etching is preferred when a high level of etching anisotropy is required
and selectivity is not a priority.
Sputter targets are also used in analytical applications by etching away the target material.
One such example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering progresses,
the concentration and identity of the sputtered atoms are measured using mass spectrometry. With the aid of the sputtering target,
the composition of the target material can be determined, allowing detection of even extremely low concentrations of impurities.
Sputtering targets also have applications in space. Sputtering is one of the processes responsible for space weathering,
which alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
