Tungsten (W) Sputtering Targets
Purity: 99.95%, Size: 6”, Thickness: 0.250”
Sputtering is a proven technique used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes.
The process involving sputter targets is repeatable and can be scaled from small research and development projects to larger production demands.
The process with sputter targets can also be adapted for production batches that include medium to large substrate areas. Depending on the process parameters,
chemical reactions may occur on the target surface, during particle flight, or directly on the substrate. Although sputter deposition involves many parameters,
this complexity provides experts with significant control over the growth and microstructure of the film.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. Deposition using sputter targets is a method of creating thin films by sputtering,
which erodes material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are also used for etching the target. Sputter etching is preferred when a high degree of etching anisotropy
is required and selectivity is not a primary concern.
Sputter targets are further used for analytical purposes by removing surface material through etching.
An example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering progresses,
the concentration and identity of the sputtered atoms are measured using mass spectrometry. With the aid of the sputtering target,
the composition of the target material can be determined, and even extremely low impurity concentrations can be detected.
Sputtering targets also have applications in space. Sputtering is one of the processes contributing to space weathering, which alters the physical
and chemical properties of airless bodies such as asteroids and the Moon.
