Tungsten Disulfide (WS2) Sputtering Targets
Purity: 99.9%, Size: 3”, Thickness: 0.125”
Sputtering is a well-established technology capable of depositing thin films from a wide range of materials onto substrates of various shapes and sizes.
The process using sputtering targets is repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, during particle flight, or on the substrate depending on the process parameters. Although sputter deposition involves many variables, this complexity provides experts with significant control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. Thin films are deposited by sputtering, a process in which material is eroded from a “target” and transferred to a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching when high anisotropic etching is required and selectivity is not critical.
Sputtering targets are also employed in analytical techniques by gradually removing target material.
One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering occurs, the concentration and identity of ejected atoms are measured using mass spectrometry. With the help of sputtering targets, the composition of the material can be determined, and even extremely low concentrations of impurities can be detected.
Sputtering targets also have applications in space. Sputtering is a form of space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
