Tungsten Disulfide (WS2) Sputtering Targets
Purity: 99.9%, Size: 5”, Thickness: 0.250”
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto substrates of diverse shapes and sizes.
The process using sputtering targets is repeatable and can be scaled up from small research and development projects to production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, in-flight, or on the substrate, depending on the process parameters. Although sputter deposition involves many variables, this complexity provides experts with substantial control over the growth and microstructure of the film.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. Thin films are deposited by sputtering, a method that erodes material from a “target” source and transfers it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used to etch the target in applications requiring a high degree of etching anisotropy where selectivity is not a major concern.
Sputtering targets are also used for analytical purposes by gradually removing target material.
One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the material is sputtered, the concentration and identity of ejected atoms are analyzed using mass spectrometry. Through this process, the composition of the target material can be determined, and even extremely low impurity levels can be detected.
Sputtering targets also have applications in space. Sputtering is one of the processes involved in space weathering, which alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
