Tungsten Disulfide (WS2) Sputtering Targets
Purity: 99.9%, Size: 8”, Thickness: 0.250”
Sputtering is a well-established technology used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, during particle flight, or on the substrate depending on process parameters. Although sputter deposition involves many variables, this complexity enables experts to maintain substantial control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. Thin films are deposited by sputtering, a technique that erodes material from a “target” and transfers it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching when a high degree of anisotropic etching is required and selectivity is not a concern.
Sputtering targets are also used for analytical purposes by gradually removing target material.
One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering proceeds, the concentration and identity of ejected atoms are measured using mass spectrometry. With the aid of sputtering targets, the material composition can be determined, and even extremely low impurity concentrations can be detected.
Sputtering targets also have applications in space. Sputtering is one of the mechanisms of space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
