Tungsten Oxide (WO3) Sputtering Targets
Purity: 99.9%, Size: 1”, Thickness: 0.250”
Sputtering is a proven technology used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to larger production batches.
The process with sputter targets can also be adapted for medium to large substrate areas. Depending on the process parameters, chemical reactions may occur on the target surface, in-flight, or on the substrate. Although sputter deposition involves many variables that make it a complex technique, these same parameters give experts a high level of control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. Thin-film deposition by sputtering involves eroding material from a “target” source and depositing it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching. Sputter etching is selected when high etching anisotropy is required and selectivity is not a primary concern.
Sputter targets are also used for analysis by gradually removing the target material.
One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering occurs, the concentration and identity of sputtered atoms are measured using mass spectrometry. With the aid of the sputtering target, the material’s composition can be analyzed, allowing even extremely low impurity concentrations to be detected.
Sputtering targets also have applications in space. Sputtering is one of the mechanisms involved in space weathering, which alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
