Tungsten Titanium (TiW) Sputtering Targets
Purity: 99.99%, Size: 1”, Thickness: 0.250”
Sputtering is a proven technology used to deposit thin films from a wide range of materials onto substrates of diverse shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to larger production requirements.
The process with sputter targets can also be adapted for production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, in-flight, or on the substrate depending on the process parameters. Although these many parameters make sputter deposition a complex process, they also provide experts with significant control over the growth and microstructure of the film.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. Thin-film deposition by sputtering involves eroding material from a “target” source and transferring it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching. Sputter etching is chosen when a high degree of etching anisotropy is required and selectivity is not a primary concern.
Sputter targets are also used for analytical applications by gradually etching away the target material.
One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. With the assistance of the sputtering target, the material’s composition can be determined, and even extremely low levels of impurities can be detected.
Sputtering targets also have applications in space. Sputtering is one of the processes associated with space weathering, which alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
