Tungsten Titanium (TiW) Sputtering Targets
Purity: 99.99%, Size: 4”, Thickness: 0.125”
Sputtering is a well-established technique used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to larger production environments.
The process with sputter targets can also be adapted for medium- to large-area substrate batches. Chemical reactions may occur on the target surface,
in-flight, or on the substrate, depending on specific process parameters. Although these many parameters make sputter deposition a complex method,
they also provide experts with significant control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. Thin-film deposition via sputtering involves removing material from a “target” and transferring it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching. Sputter etching is selected when a high level of etching anisotropy is required and selectivity is not critical.
Sputter targets are also used in analytical applications by progressively etching away the target material.
One example is secondary ion spectroscopy (SIMS), where a target sample is sputtered at a constant rate. As sputtering occurs, the concentration and identity of ejected atoms are measured using mass spectrometry. With the aid of the sputtering target, the composition of the material can be determined, and even extremely low impurity levels can be detected.
Sputtering targets also have applications in space. Sputtering is one form of space weathering—a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
