Vanadium (V) Sputtering Targets
Purity: 99.5%, Size: 4”, Thickness: 0.125”
Sputtering is a well-established technology used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to larger production needs.
Sputter target processes can also be adapted for production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, in-flight, or on the substrate itself, depending on the selected process parameters. Although sputter deposition involves many variables that make it a complex technique, these same parameters allow experts substantial control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. The deposition performed with sputter targets is a method of creating thin films through sputtering, which erodes material from a “target” source and deposits it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching, particularly when a high degree of anisotropic etching is required and selectivity is not a primary concern.
Sputter targets are also used in analytical applications by gradually removing target material.
One example is secondary ion mass spectroscopy (SIMS), where the target sample is sputtered at a controlled rate. As sputtering occurs, the concentration and identity of ejected atoms are measured using mass spectrometry. With the help of the sputtering target, the composition of the material can be determined, and even extremely low impurity concentrations can be detected.
Sputtering targets also have applications in space. Sputtering is one of the mechanisms involved in space weathering, a process that alters the physical and chemical properties of airless bodies such as the Moon and asteroids.
