Vanadium Oxide (V2O5) Sputtering Targets
Purity: 99.9%, Size: 3”, Thickness: 0.250”
Sputtering is a proven technology used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes. The process using sputter targets is repeatable and can be scaled up from small research and development projects. The process with sputter targets can also be adapted for production batches involving medium to large substrate areas. Depending on the process parameters, chemical reactions may occur on the target surface, during particle travel, or directly on the substrate. Although sputter deposition involves many variables and is therefore complex, this complexity provides experts with significant control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. This deposition method involves eroding material from a “target” source onto a “substrate,” such as a silicon wafer. Semiconductor sputtering targets are used for etching applications, particularly when a high degree of etching anisotropy is required and selectivity is not a concern. Sputter targets are also utilized in analytical techniques by progressively removing target material. One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate, and the concentration and identity of sputtered atoms are analyzed using mass spectrometry. Using the sputtering target, the composition of the target material can be determined, and even extremely low impurity concentrations can be detected. Sputtering targets also have relevance in space applications, as sputtering is one of the processes involved in space weathering, altering the physical and chemical properties of airless bodies such as asteroids and the Moon.
