Vanadium Oxide (V2O5) Sputtering Targets
Purity: 99.9%, Size: 4”, Thickness: 0.250”
Sputtering is a reliable and widely used technology for depositing thin films from various materials onto substrates of different shapes and sizes. The process using sputter targets is repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, during particle travel, or on the substrate, depending on the process parameters. Although sputter deposition involves many variables and is therefore complex, this complexity allows experts significant control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition, where material is eroded from a “target” and deposited onto a “substrate,” such as a silicon wafer. Semiconductor sputtering targets are used for etching applications when high anisotropy is required and selectivity is not a priority. Sputtering targets are also used in analytical techniques by gradually removing target material; one example is secondary ion spectroscopy (SIMS), where the target is sputtered at a constant rate and the resulting atoms are analyzed using mass spectrometry to determine composition and detect impurities. Sputtering also has relevance in space applications; it is one of the mechanisms of space weathering, altering the physical and chemical properties of airless bodies such as asteroids and the Moon.
