Zinc Oxide (ZnO) with Alumina Sputtering Targets
Purity: 99.95%, Size: 3”, Thickness: 0.125”
Sputtering is a well-established technology for depositing thin films from a wide range of materials onto substrates of various shapes and sizes. The process using sputter targets is repeatable and can be scaled from small research and development projects to production batches covering medium to large substrate areas. Depending on the process parameters, chemical reactions may occur on the target surface, in-flight, or on the substrate. While sputter deposition involves multiple variables, it provides experts with a high level of control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. The deposition process with sputter targets involves eroding material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used to etch the target. Sputter etching is chosen when a high degree of etching anisotropy is required, and selectivity is not a concern.
Sputter targets are also used for analysis by etching away the target material.
One example is secondary ion mass spectroscopy (SIMS), where the target sample is sputtered at a constant rate. During sputtering, the concentration and identity of sputtered atoms are measured using mass spectrometry. With the help of the sputtering target, the composition of the target material can be determined, and even extremely low concentrations of impurities can be detected.
Sputtering targets also have applications in space. Sputtering is one form of space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
