Zinc Oxide (ZnO) with Alumina Sputtering Targets
Purity: 99.99%, Size: 3”, Thickness: 0.125”
Sputtering is a proven technology for depositing thin films from a wide variety of materials onto substrates of diverse shapes and sizes. The process using sputter targets is repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. Depending on process parameters, chemical reactions may occur on the target surface, in-flight, or on the substrate. While sputter deposition involves many variables, it provides experts with a high degree of control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. The deposition produced by sputter targets is a method of depositing thin films by sputtering, which involves eroding material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed, and selectivity is not a concern.
Sputter targets are also used for analysis by etching away the target material.
One example occurs in secondary ion mass spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering proceeds, the concentration and identity of sputtered atoms are measured using mass spectrometry. With the help of the sputtering target, the composition of the target material can be determined, and even extremely low concentrations of impurities can be detected.
Sputtering targets also have applications in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.
