Zinc (Zn) Sputtering Targets
Purity: 99.95%, Size: 1”, Thickness: 0.125”
Sputtering is a proven technology used to deposit thin films from a wide range of materials onto various substrate shapes and sizes. The process using sputter targets is repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. Depending on the process parameters, chemical reactions may occur on the target surface, in-flight, or on the substrate. Although sputter deposition involves many variables and is therefore complex, it provides experts with extensive control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. Thin films are deposited through sputtering, a process in which material is eroded from a “target” source and transferred onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for target etching. Sputter etching is selected when a high degree of etching anisotropy is required and selectivity is not critical.
Sputter targets are also used for analytical purposes by etching away material from the target surface.
One example occurs in secondary ion mass spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering progresses, the concentration and identity of ejected atoms are analyzed using mass spectrometry. Through this process, the composition of the target material can be identified, and even extremely low concentrations of impurities can be detected.
Sputtering targets are also used in space-related applications. Sputtering is a form of space weathering, which alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
