Zinc (Zn) Sputtering Targets
Purity: 99.99%, Size: 1”, Thickness: 0.250”
Sputtering is a proven technique used to deposit thin films from numerous materials onto substrates of various shapes and sizes.
The process using sputter targets is highly repeatable and can be scaled from small research and development applications to production batches involving medium to large substrate areas. Depending on process parameters, chemical reactions may occur on the target surface, in-flight, or on the substrate. Although sputter deposition involves many variables, this complexity provides experts with significant control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. This thin-film deposition method involves the erosion of material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching. Sputter etching is selected when a high degree of anisotropy is required and selectivity is not a primary concern.
Sputter targets are also used in analytical applications by gradually etching away material.
One example is secondary ion mass spectrometry (SIMS), where the sample is sputtered at a constant rate. As sputtering occurs, the concentration and identity of ejected atoms are measured using mass spectrometry. Through this method, the composition of the target material can be determined, allowing the detection of extremely low impurity levels.
Sputtering targets also have applications in space science. Sputtering is one of the mechanisms involved in space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
