Zinc (Zn) Sputtering Targets
Purity: 99.95%, Size: 2”, Thickness: 0.125”
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto substrates of different shapes and sizes.
The process using sputter targets is highly repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, in-flight, or on the substrate, depending on the process parameters. Although sputter deposition involves many variables, this complexity provides experts with significant control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. The deposition achieved with sputter targets is a thin-film formation method that erodes material from a “target” source and transfers it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching. Sputter etching is preferred in cases requiring a high degree of anisotropy where selectivity is not a critical factor.
Sputter targets are also utilized for analytical purposes by etching away target material.
One example is secondary ion mass spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering occurs, the concentration and identity of sputtered atoms are measured using mass spectrometry. With the assistance of the sputtering target, the composition of the material can be determined, allowing detection of even extremely low impurity concentrations.
Sputtering targets also have applications in space. Sputtering is one of the mechanisms involved in space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
