Titanium Dioxide (TiO₂) Sputtering Targets
Purity: 99.9%, Size: 4”, Thickness: 0.125”, Grey to Black
Sputtering is a well-established method for depositing thin films from a wide range of materials onto substrates of various shapes and sizes.
The process using sputter targets is consistent, repeatable, and can be scaled from small research and development projects to larger production batches involving medium to large substrate areas. Depending on the process parameters, chemical reactions may occur on the target surface, during material transport, or on the substrate. While sputter deposition is a complex technique with many variables, it offers experts precise control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. This method deposits thin films by sputtering, which involves eroding material from a “target” and transferring it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are also used for etching. Sputter etching is chosen when a high degree of etching anisotropy is required and selectivity is not critical.
Sputtering targets are additionally used for analytical purposes, by removing material from the target.
An example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. During sputtering, the identity and concentration of atoms are measured via mass spectrometry. Using sputtering targets, the composition of the material can be determined, including detection of extremely low concentrations of impurities.
Sputtering targets also have applications in space. Sputtering contributes to space weathering, a process that alters the physical and chemical properties of airless bodies, such as asteroids and the Moon.
