Titanium Dioxide (TiO₂) Sputtering Targets
Purity: 99.99%, Size: 4”, Thickness: 0.125”, Beige to White
Sputtering is an established method used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes.
The process using sputter targets is consistent, repeatable, and can be scaled from small research and development applications to larger production batches involving medium to large substrate areas. Depending on the process parameters, chemical reactions may occur on the target surface, during material transport, or on the substrate. Although sputter deposition involves many variables and is a complex technique, it allows specialists to maintain precise control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. This technique produces thin films by sputtering, a process that removes material from a “target” and deposits it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are also used for etching applications. Sputter etching is selected when a high degree of etching anisotropy is required and selectivity is not a primary concern.
Sputtering targets are additionally used in analytical methods that remove material from the target surface.
One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As atoms are sputtered from the surface, their identity and concentration are analyzed using mass spectrometry. With the use of sputtering targets, the composition of the material can be examined in detail, enabling detection of even extremely low impurity levels.
Sputtering targets also have applications in space science. Sputtering is one of the processes involved in space weathering, which alters the physical and chemical properties of airless bodies, including asteroids and the Moon.
