Titanium Dioxide (TiO₂) Sputtering Targets
Purity: 99.99%, Size: 8”, Thickness: 0.250”, Beige to White
Sputtering is a proven technology capable of depositing thin films from a wide range of materials onto diverse substrate shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to larger production environments. Sputter targets can be adapted to production batches involving medium to large substrate areas. Depending on the process parameters, chemical reactions may occur on the target surface, in-flight, or on the substrate. Although sputter deposition involves many parameters and is a complex process, it offers experts significant control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. This method produces thin films by sputtering, a process in which material is eroded from a “target” source and deposited onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching. Sputter etching is selected when a high degree of etching anisotropy is required and selectivity is not critical.
Sputter targets are also used for analytical purposes by etching away target material.
One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering occurs, the concentration and identity of sputtered atoms are measured using mass spectrometry. With the help of a sputtering target, the composition of the material can be determined, and even extremely low impurity concentrations can be detected.
Sputtering targets also have applications in space. Sputtering is a form of space weathering, a process that alters the physical and chemical properties of airless bodies, such as asteroids and the Moon.
