Titanium Dioxide (TiO2) Sputtering Targets, indium
Purity: 99.9%, Size: 3”, Thickness: 0.125”, Grey to Black
Sputtering is a proven technology capable of depositing thin films from a wide range of materials onto diverse substrate shapes and sizes.
The process using sputter targets is repeatable and can be scaled up from small research and development projects. The process with sputter targets can also be adapted to production batches involving medium to large substrate areas. The chemical reaction may occur on the target surface, in-flight, or on the substrate depending on the process parameters. Although sputter deposition involves many parameters, making it a complex process, it provides experts with a high level of control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. The deposition performed using sputter targets is a method of creating thin films by sputtering, which involves eroding material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used to etch the target. Sputter etching is selected in cases requiring a high degree of etching anisotropy when selectivity is not a concern.
Sputter targets are also used for analysis by etching away the target material.
One example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. With the aid of the sputtering target, the composition of the target material can be determined, and even extremely low concentrations of impurities can be detected.
Sputtering targets also find application in space. Sputtering is one of the forms of space weathering, a process that alters the physical and chemical properties of airless bodies, such as asteroids and the Moon.
