Manganese (Mn) Sputtering Targets
Purity: 99.95%, Size: 1”, Thickness: 0.125”
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto diverse substrate shapes and sizes. The sputtering process is repeatable and can be scaled up from small research and development projects to production batches involving medium to large substrate areas. Depending on the process parameters, chemical reactions may occur on the target surface, in-flight, or directly on the substrate. Although sputter deposition involves many variables and is a complex process, these parameters give experts significant control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. This method deposits thin films by sputtering, which involves eroding material from a “target” source onto a “substrate” such as a silicon wafer. Semiconductor sputtering targets are used for etching the target, particularly when a high degree of etching anisotropy is required and selectivity is not a critical factor.
Sputter targets are also used for analysis by etching away the target material. One example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. With the aid of the sputtering target, the composition of the material can be determined, allowing even extremely low concentrations of impurities to be detected.
Sputtering targets also have application areas in space. Sputtering is one of the forms of space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
