Manganese (Mn) Sputtering Targets
Purity: 99.95%, Size: 2”, Thickness: 0.125”
Sputtering is a proven technology used to deposit thin films from a wide variety of materials onto diverse substrate shapes and sizes. The process with sputter targets is highly repeatable and can be scaled from small research and development projects to larger production batches. Sputter targets can be adapted for medium to large substrate areas, with chemical reactions occurring on the target surface, in-flight, or on the substrate depending on the process parameters. These numerous parameters make sputter deposition a complex process, yet they provide experts with extensive control over the growth and microstructure of the deposited film.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. This method deposits thin films by sputtering, which involves eroding material from a “target” source onto a “substrate” such as a silicon wafer. Semiconductor sputtering targets are used for etching, with sputter etching selected when a high degree of etching anisotropy is required and selectivity is not a primary concern. Sputter targets are also used for analytical purposes by removing target material through etching.
One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering occurs, the concentration and identity of sputtered atoms are measured using mass spectrometry. With the assistance of the sputtering target, the composition of the target material can be determined, and even extremely low concentrations of impurities can be detected.
Sputtering targets also have applications in space. Sputtering is one of the forms of space weathering, a process that alters the physical and chemical properties of airless bodies, such as asteroids and the Moon.
