Aluminum (Al) Sputtering Targets
Purity: 99.999% Size: 4” Thickness: 0.250”
Aluminum sputtering targets provide a reliable solution for depositing high-quality thin films onto a variety of substrate shapes and sizes. The sputtering process is highly repeatable and scalable, suitable for both small research projects and medium-to-large production batches. Depending on process parameters, chemical reactions may occur on the target surface, in-flight, or on the substrate, giving precise control over film growth and microstructure.
Applications of Sputtering Targets
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Thin-Film Deposition:
Enables uniform film deposition by eroding material from the target onto substrates such as silicon wafers. -
Semiconductor Etching:
Effective for sputter etching when high anisotropy is required, independent of selectivity. -
Material Analysis (SIMS):
Facilitates secondary ion mass spectrometry for precise composition analysis and detection of trace impurities. -
Space Applications:
Used in space weathering studies, affecting physical and chemical properties of airless bodies like asteroids and the Moon.
Material Advantages
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Silvery-white, lightweight, soft, and ductile metal.
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Strong corrosion resistance with a thin, durable oxide layer.
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High thermal and electrical conductivity.
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Fine-grained microstructure ensures uniform erosion and minimal particle formation during sputtering.
