Aluminum (Al) Sputtering Targets
Purity: 99.99% Size: 6” Thickness: 0.250”
Aluminum sputtering targets are engineered for depositing thin films on a wide range of substrate shapes and sizes. The sputtering process is highly repeatable and scalable, suitable for both research and medium-to-large production batches. Depending on process parameters, chemical reactions can occur on the target surface, in-flight, or on the substrate, allowing precise control over film growth and microstructure.
Applications of Sputtering Targets
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Thin-Film Deposition:
Facilitates uniform material transfer from the target to substrates such as silicon wafers. -
Semiconductor Etching:
Ideal for sputter etching requiring high anisotropy, even when selectivity is not critical. -
Material Analysis (SIMS):
Supports secondary ion mass spectrometry for composition analysis and detection of trace impurities. -
Space Applications:
Used in studies of space weathering, which alters the physical and chemical properties of airless bodies like asteroids and the Moon.
Material Advantages
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Silvery-white, lightweight, soft, and ductile metal.
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Excellent corrosion resistance with a strong, thin oxide layer.
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High thermal and electrical conductivity.
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Fine-grained microstructure ensures uniform erosion and minimal particle formation during sputtering.
