Aluminum Silicon Copper (AlSiCu) Sputtering Targets
Purity: 99.999% Size: 4” Thickness: 0.250”
AlSiCu sputtering targets are engineered for precise thin-film deposition on a wide variety of substrate shapes and sizes. The sputtering process is repeatable, scalable, and adaptable for research, development, and production batches. Reactions can occur on the target surface, in-flight, or on the substrate, allowing fine control over film growth and microstructure.
Applications of Sputtering Targets
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Thin-Film Deposition:
Deposits material from the target onto substrates, such as silicon wafers, forming uniform and high-quality thin films. -
Semiconductor Etching:
Suitable for sputter etching when high anisotropy is required and selectivity is less critical. -
Material Analysis (SIMS):
Supports secondary ion mass spectrometry to determine target composition and detect trace impurities. -
Space Applications:
Plays a role in space weathering, altering the physical and chemical properties of airless bodies like asteroids and the Moon.
Material Advantages of AlSiCu Targets
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Lightweight yet high-strength aluminum alloy, enhanced with silicon and copper.
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High-strength AlSiCu alloys are ideal for aerospace, automotive, and transportation applications.
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Excellent casting, machining, corrosion resistance, and weldability.
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Suitable for engine parts, gas and oil pans, and general commercial uses.
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High purity ensures uniform thin films for semiconductor applications.
