Aluminum Silicon (AlSi) Sputtering Targets
Purity: 99.999% Size: 2” Thickness: 0.250”
Aluminum Silicon (AlSi) sputtering targets provide precise thin-film deposition across a wide variety of substrate shapes and sizes. The sputtering process is highly repeatable and scalable, suitable for both small research projects and medium-to-large production batches. Chemical reactions can occur on the target surface, in-flight, or on the substrate depending on process parameters, giving experts significant control over film growth and microstructure.
Applications of Sputtering Targets
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Thin-Film Deposition:
Deposits material from the target onto substrates such as silicon wafers to form uniform thin films. -
Semiconductor Etching:
Ideal for sputter etching when high anisotropy is required and selectivity is not critical. -
Material Analysis (SIMS):
Enables secondary ion mass spectrometry for determining target composition and detecting trace impurities. -
Space Applications:
Contributes to space weathering, altering the physical and chemical properties of airless bodies such as asteroids and the Moon.
