Aluminum Silicon (AlSi) Sputtering Targets
Purity: 99.999% Size: 4” Thickness: 0.125”
Aluminum Silicon (AlSi) sputtering targets are designed for precise thin-film deposition on a variety of substrate shapes and sizes. Sputtering is a repeatable, scalable process suitable for research, development, and medium-to-large production batches. Depending on the process parameters, chemical reactions can occur on the target surface, during particle transport, or directly on the substrate, allowing fine control over film growth and microstructure.
Applications of Sputtering Targets
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Thin-Film Deposition:
Deposits thin films by sputtering, transferring material from a target source onto substrates such as silicon wafers. -
Semiconductor Etching:
Sputter etching provides high anisotropy for applications where selectivity is not critical. -
Material Analysis (SIMS):
In secondary ion mass spectrometry, the target is sputtered at a constant rate to measure the composition and trace impurities with high sensitivity. -
Space Applications:
Sputtering contributes to space weathering processes that modify the chemical and physical properties of airless bodies, including asteroids and the Moon.
