Barium (Ba) Sputtering Targets
Purity: 99.5% | Size: 4” | Thickness: 0.250”
Sputtering is a reliable method for depositing thin films on a wide variety of substrates. This barium sputtering target provides repeatable performance and scalability, from small R&D projects to medium- and large-scale production. Reactions can occur on the target surface, in-flight, or on the substrate depending on process parameters, offering precise control over film growth and microstructure.
Applications:
-
Thin-film deposition on substrates such as silicon wafers.
-
Semiconductor etching where high anisotropy is required.
-
Material analysis, including SIMS, for detecting even trace impurities.
-
Space applications: sputtering contributes to space weathering on airless bodies like asteroids and the Moon.
About Barium (Ba):
Barium (atomic number 56) is an alkaline-earth metal with excellent electrical properties, making it ideal for sputtering applications. It is used in electronic device plating, semiconductor devices, and flat panel displays. Barium also forms alloys with metals like strontium and titanium, enhancing properties for specialized sputtering applications.
