Barium Fluoride (BaF₂) Sputtering Targets
Purity: 99.99% | Size: 8” | Thickness: 0.125”
Sputtering is a well-established technique for depositing thin films onto a wide variety of materials and substrate shapes. The process using sputter targets is highly repeatable and scalable, suitable for both small research and development projects and production batches involving medium to large substrate areas. Depending on the process parameters, chemical reactions can occur on the target surface, in-flight, or on the substrate. While sputter deposition is complex, it provides precise control over film growth and microstructure.
Applications of Sputtering Targets:
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Thin-film deposition by transferring material from a “target” onto a “substrate,” such as silicon wafers.
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Semiconductor etching, where high etching anisotropy is required and selectivity is not critical.
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Analytical applications, including secondary ion spectroscopy (SIMS), where sputtering enables precise measurement of material composition and detection of trace impurities.
Sputtering targets also have applications in space research, as sputtering contributes to space weathering, altering the physical and chemical properties of airless bodies like asteroids and the Moon.
About Barium Fluoride (BaF₂):
Barium fluoride is a chemical compound of barium and fluorine, appearing as a solid that can form transparent crystals. It is effective in the 10–20 µm infrared wavelength range. Industrial applications include aluminum metallurgy, enamel and glazing frit production, and welding agent preparation. In aluminum refining, BaF₂ acts as an additive, aiding in chemical polishing to achieve bright reflective surfaces. In flux brazing of aluminum and its alloys, inorganic fluorides such as BaF₂ are critical for removing oxide layers and ensuring high-quality surface treatment.
