Selenium (Se) Sputtering Targets, Elastomer
Purity: 99.999%, Size: 2”, Thickness: 0.125”
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto diverse substrate shapes and sizes. The process with sputter targets is repeatable and can be scaled up from small research and development projects. The process with sputter targets can be adapted to production batches involving medium to large substrate areas. The chemical reaction can occur on the target surface, in-flight, or on the substrate depending on the process parameters. The many parameters make sputter deposition a complex process but provide experts with a high degree of control over the growth and microstructure of the film.
Applications of Sputtering Targets
Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a “target” source onto a “substrate” such as a silicon wafer. Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern. Sputter targets is also used for analysis by etching away the target material. One of the examples occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected. Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.
