Silicon (Si) Sputtering Targets, P-type
Purity: 99.999%, Size: 1”, Thickness: 0.125”
Sputtering is a proven technology used to deposit thin films from a wide variety of materials onto substrates of different shapes and sizes.
The sputtering process is highly repeatable and can be scaled from small research and development applications to production batches involving
medium to large substrate areas. Depending on the process parameters, chemical reactions may occur on the target surface, during particle flight,
or directly on the substrate. While sputter deposition involves many variables, this complexity provides experts with precise control over film
growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for thin-film deposition by eroding material from a “target” source and depositing it onto a “substrate,” such as a
silicon wafer.
Semiconductor sputtering targets are also used for etching applications, especially when a high degree of etching anisotropy is needed and
selectivity is not a primary requirement.
Additionally, sputter targets play an important role in analytical methods that involve controlled removal of material from the target surface.
A key example is secondary ion mass spectroscopy (SIMS). In this technique, the sample is sputtered at a constant rate, and the sputtered atoms
are analyzed using mass spectrometry. With the help of the sputtering target, the material composition can be accurately determined, detecting
even extremely low concentrations of impurities.
Sputtering targets also have applications in space science. Sputtering is one of the primary processes involved in space weathering, which alters
the physical and chemical properties of airless celestial bodies such as asteroids and the Moon.
