Silicon (Si) Sputtering Targets, P-type
Purity: 99.999%, Size: 2”, Thickness: 0.125”
Sputtering is a proven technology capable of depositing thin films from a wide range of materials onto substrates of various shapes and sizes.
The process using sputter targets is highly repeatable and can be scaled from small research and development projects to production batches
involving medium to large substrate areas. Depending on the process parameters, chemical reactions may occur on the target surface, in-flight,
or on the substrate. Although sputter deposition involves many variables, this complexity provides experts with extensive control over film
growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition, a method in which material is eroded from a “target” and deposited onto a “substrate,” such as
a silicon wafer.
Semiconductor sputtering targets are also employed for etching when a high degree of etching anisotropy is required and selectivity is not a
primary concern.
Sputter targets are further utilized in analytical applications that involve gradually etching away the target material.
One example occurs in secondary ion mass spectrometry (SIMS), where the target sample is sputtered at a constant rate. As the material is
removed, the concentration and identity of sputtered atoms are measured using mass spectrometry. With the aid of sputtering targets, the
composition of the sample can be accurately determined, enabling detection of even extremely low impurity concentrations.
Sputtering targets also have applications in space science. Sputtering is one of the mechanisms involved in space weathering, a process that
alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
