Silicon (Si) Sputtering Targets, P-type
Purity: 99.999%, Size: 3”, Thickness: 0.250”
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto diverse substrate shapes and sizes.
The process using sputter targets is repeatable and can be scaled up from small research and development projects. It can also be adapted
to production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, in-flight, or on the
substrate depending on the process parameters. The numerous variables involved make sputter deposition a complex process, but they also
provide experts with significant control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. This method involves eroding material from a “target” source and depositing it onto a
“substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching processes where a high degree of anisotropy is required and selectivity is not the
primary concern.
Sputter targets are also used for analytical applications that require controlled removal of material.
One example is secondary ion mass spectrometry (SIMS), where the target sample is sputtered at a constant rate. As the material is removed,
the identity and concentration of sputtered atoms are measured using mass spectrometry. With the aid of the sputtering target, the
composition of the material can be determined, allowing even extremely low impurity concentrations to be detected.
Sputtering targets also have applications in space science. Sputtering is one of the processes involved in space weathering, which alters
the physical and chemical properties of airless celestial bodies such as asteroids and the Moon.
