Barium Titanate (BaTiO₃) Sputtering Targets
Purity: 99.99% | Size: 8” | Thickness: 0.125”
Overview:
Barium titanate (BaTiO₃) sputtering targets are high-purity ceramic materials engineered for precision thin film deposition. Sputtering is a proven technique for transferring material from the target onto diverse substrates, offering controlled growth and microstructure of thin films. The process is scalable, suitable for both research and development and medium to large production batches. Chemical reactions can occur on the target surface, in-flight, or on the substrate, depending on process parameters, giving experts a high degree of control over the deposition process.
Applications:
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Thin Film Deposition: Uniform material deposition on substrates such as silicon wafers.
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Semiconductor Etching: Sputter etching provides high anisotropy where selectivity is less critical.
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Material Analysis: Enables trace impurity detection and composition analysis using secondary ion mass spectrometry (SIMS).
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Space Applications: Simulates space weathering, affecting physical and chemical properties of airless bodies like asteroids and the Moon.
Material Properties:
Barium titanate is a white inorganic compound that appears transparent when prepared as large crystals. It is a ferroelectric ceramic with photorefractive and piezoelectric properties, making it suitable for:
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Electronic ceramics
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Detectors
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Capacitors
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Sensors
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Other electronic device assemblies
Key Features:
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High-purity (99.99%) BaTiO₃ for consistent thin film growth
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Compatible with semiconductor, CVD, and PVD processes
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Supports ferroelectric and piezoelectric applications
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Precise control over microstructure and deposition.
