Barium Zirconate (BaZrO₃) Sputtering Targets
Purity: 99.99% Size: 4” Thickness: 0.125”
Overview:
Barium Zirconate sputtering targets are engineered for precise thin film deposition on a wide range of substrate shapes and sizes. The sputtering process is repeatable and scalable, supporting both research and development as well as medium-to-large production batches. Chemical reactions can occur on the target surface, in-flight, or on the substrate depending on process parameters, offering controlled growth and microstructure of thin films.
Applications:
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Thin film deposition on substrates like silicon wafers.
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Semiconductor etching requiring high anisotropy.
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Analytical applications such as SIMS for precise composition and impurity detection.
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Space research, including studies of space weathering on airless bodies.
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Electroceramic uses in semiconductors, CVD/PVD displays, and optical devices.
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Ferroelectric and dielectric thin-film applications.
Material Properties:
Barium Zirconate (BaZrO₃) is an electroceramic valued for its excellent electrical properties, chemical stability, and compatibility with PVD and CVD deposition techniques. Its high purity ensures consistent performance in advanced electronic, optical, and ferroelectric applications.











