Bismuth (Bi) Sputtering Targets
Purity: 99.9% Size: 4” Thickness: 0.250”
Sputtering is a reliable method for depositing thin films from various materials onto diverse substrate shapes. The process is highly repeatable and scalable, suitable for both small research projects and medium-to-large production batches. Chemical reactions may occur on the target surface, in-flight, or on the substrate, depending on the process parameters, giving experts precise control over film growth and microstructure.
Applications of Sputtering Targets
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Thin Film Deposition: Material from the target is transferred onto substrates such as silicon wafers.
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Semiconductor Etching: Ideal for processes requiring high etching anisotropy without stringent selectivity.
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Material Analysis: Supports methods like Secondary Ion Mass Spectroscopy (SIMS) to determine composition and detect trace impurities.
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Space Applications: Contributes to space weathering, modifying the physical and chemical properties of airless bodies like asteroids and the Moon.
About Bismuth (Bi)
Bismuth is a brittle, silvery-pink metal that is stable in air and water. Despite its low thermal and electrical conductivity, it has specialized applications:
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Alloys & Fuses: Used in low-melting fusible alloys, solders, and thermal fuses.
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Radiation Applications: High gamma-ray absorption makes it useful as filters or windows for radiation, while allowing neutrons to pass.
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Thermoelectrics & Magnetoresistance Devices: Exploits its thermal conductivity and magneto-resistance properties.
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Thin Film Semiconductors: Bi films can become semiconducting at thicknesses around 30 nm, depositable via RF/DC sputtering, pulsed laser deposition, or thermal evaporation.
Film properties strongly depend on deposition conditions, including substrate temperature, target potential, ion beam energy, and energy release rate during deposition. In DC sputtering, applying positive pulses between substrate and target can improve film density and mechanical performance.
