Molybdenum (Mo) Sputtering Targets
Purity: 99.95%, Size: 8”, Thickness: 0.125”
Sputtering is a well-established technology capable of depositing thin films from a wide variety of materials onto substrates of different shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to larger production batches. Sputter
targets can be adapted for medium to large substrate areas. Chemical reactions may occur on the target surface, during particle flight, or on the substrate
depending on the process parameters. Although sputter deposition involves many variables that make the process complex, this complexity provides experts
with significant control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. The deposition performed using sputter targets is a method of creating thin films by sputtering,
which involves eroding material from a “target” and depositing it onto a “substrate” such as a silicon wafer.
Semiconductor sputtering targets are used for etching the target. Sputter etching is selected when a high degree of etching anisotropy is required
and selectivity is not a critical factor.
Sputter targets are also used for analytical purposes by etching away the target material.
One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is eroded, the concentration
and identity of sputtered atoms are measured using mass spectrometry. With the help of the sputtering target, the composition of the target material
can be determined, and even extremely low impurity concentrations can be detected.
Sputtering targets also have applications in space. Sputtering is one form of space weathering—a process that alters the physical and chemical
properties of airless bodies such as asteroids and the Moon.
