Molybdenum Disilicide (MoSi2) Sputtering Targets
Purity: 99.95%, Size: 1”, Thickness: 0.250”
Sputtering is a proven technology used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes.
The sputtering process is highly repeatable and can be scaled from small research and development projects to medium and large production batches. It can be adapted for use with different substrate areas, providing flexibility across applications. Depending on specific process parameters, chemical reactions may occur on the target surface, during particle flight, or on the substrate itself.
Although sputter deposition involves many variables, making it a complex technique, these same variables give specialists extensive control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. Thin film deposition by sputtering involves eroding material from a “target” and depositing it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching when a high degree of anisotropy is required and selectivity is not a priority.
Sputtering targets are also used for analytical purposes by etching away the target material.
One example is secondary ion mass spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering proceeds, the concentration and identity of emitted atoms are analyzed using mass spectrometry. Through this process, the composition of the target material can be identified, and extremely low impurity concentrations can be detected.
Sputtering targets also have applications in space. Sputtering is one of the mechanisms of space weathering, a process that alters the physical and chemical properties of airless bodies such as the Moon and asteroids.
