Molybdenum Disulfide (MoS₂) Sputtering Targets
Purity: 99.9%, Size: 3”, Thickness: 0.250”
Sputtering is a proven technique used to deposit thin films from a wide range of materials onto various substrate shapes and sizes.
The sputtering process is repeatable and can be scaled from small research and development projects to larger production environments.
Sputter targets can be adapted for production batches involving medium to large substrate areas. Depending on the process parameters, chemical reactions may occur on the target surface, during particle flight, or on the substrate. Although sputter deposition involves many variables that make the process complex, these same parameters provide experts with significant control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. Thin film formation through sputtering involves eroding material from a “target” and depositing it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are also used for etching applications. Sputter etching is selected when a high degree of anisotropy is required and selectivity is not a primary concern.
Sputter targets are additionally used for analytical applications, where controlled material removal is needed.
One example is secondary ion spectroscopy (SIMS), in which the target sample is sputtered at a constant rate. As the material is sputtered, the concentration and identity of the ejected atoms are measured using mass spectrometry. This enables determination of the target material’s composition and detection of extremely low impurity levels.
Sputtering targets also have applications in space environments. Sputtering is one form of space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
