Boron (B) Sputtering Targets
Purity: 99.9% Size: 3” Thickness: 0.250”
Sputtering is a well-established technique for depositing thin films from a wide range of materials onto substrates of various shapes and sizes. The process using sputter targets is reproducible and scalable, suitable for both small research projects and medium-to-large production batches. Chemical reactions may occur on the target surface, in-flight, or on the substrate, depending on process parameters. Although sputter deposition is complex, experts can precisely control the growth and microstructure of the resulting films.
Applications of Sputtering Targets
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Thin Film Deposition: Erosion of material from a target onto substrates like silicon wafers.
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Semiconductor Etching: Sputter etching provides high anisotropy when selectivity is not critical.
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Analytical Techniques: Secondary ion mass spectrometry (SIMS) measures target composition and detects trace impurities.
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Space Applications: Sputtering contributes to space weathering, altering the properties of airless bodies such as asteroids and the Moon.
Boron in Coatings and Thin Films
Boron is widely applied in ion implantation and thin film technologies:
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Ion-beam doping of semiconductors
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Surface modification via ion implantation
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Synthesis of boron-containing films and coatings, including boron nitride
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Trench filling in particle detectors
Boron-based coatings improve material surfaces with high hardness, toughness, wear and corrosion resistance, and in some cases, properties comparable to diamond.
Magnetron Sputtering of Boron:
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Planar magnetron targets of boron-containing compounds are used to produce films, where non-boron components help form the desired boron compound or provide electrical conductivity.
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Pure boron targets are extensively used for semiconductor doping and reactive magnetron sputtering of boron nitride films in a nitrogen atmosphere.
