Boron Carbide (B4C) Sputtering Targets
Purity: 99.5% Size: 6” Thickness: 0.250”
Sputtering is a proven thin-film deposition method capable of transferring material onto substrates of various shapes and sizes. Processes using sputter targets are highly repeatable and can be scaled from small research applications to medium- and large-area production environments. Depending on process parameters, chemical reactions may occur on the target surface, during particle transport, or on the substrate itself. Although sputtering involves many interacting variables, it offers precise control over film growth and microstructure.
Applications of Sputtering Targets
-
Thin-Film Deposition:
Sputtering targets are widely used to deposit thin films by eroding material from a “target” and transferring it to a “substrate,” such as a silicon wafer. -
Semiconductor Fabrication:
Semiconductor sputtering targets are used for etching where high anisotropy is required and selectivity is less critical. -
Analytical Techniques:
In processes such as Secondary Ion Mass Spectroscopy (SIMS), materials are sputtered at a controlled rate, allowing analysis of sputtered atoms. This enables determination of material composition and detection of extremely low impurity concentrations. -
Space Applications:
Sputtering also occurs naturally in space, contributing to space weathering—changes in physical and chemical properties on airless bodies like the Moon and asteroids.
