Copper (Cu) Sputtering Targets (3” × 0.125”, 99.99% purity)
| Section | Details |
|---|---|
| Product Name | Copper (Cu) Sputtering Targets |
| Purity | 99.99% |
| Size | 3” |
| Thickness | 0.125” |
| Process Overview | Sputtering deposits thin films from various materials onto diverse substrate shapes and sizes. The process is repeatable and scalable from small R&D to medium/large production. Reactions may occur on the target surface, in-flight, or on the substrate, and multiple parameters allow precise control of film growth and microstructure. |
| Applications | – Thin film deposition onto substrates such as silicon wafers. – Semiconductor etching requiring high anisotropy. – Analytical applications like SIMS to measure composition and detect impurities. – Space applications: space weathering affecting physical and chemical properties of airless bodies like asteroids and the Moon. |
