Copper (Cu) Sputtering Targets (3” × 0.125”)
| Section | Details |
|---|---|
| Product Name | Copper (Cu) Sputtering Targets |
| Purity | 99.999% |
| Size | 3” |
| Thickness | 0.125” |
| Process Overview | Sputtering deposits thin films from a wide range of materials onto diverse substrates. The process is repeatable and scalable from R&D to medium/large production. Chemical reactions can occur on the target surface, in-flight, or on the substrate. Multiple parameters allow precise control of growth and microstructure. |
| Applications | – Thin film deposition onto substrates such as silicon wafers. – Semiconductor etching requiring high anisotropy. – Analytical applications like SIMS for composition and impurity detection. – Space applications: contributes to space weathering affecting physical and chemical properties of airless bodies (e.g., asteroids, Moon). |
