Copper (Cu) Sputtering Targets (3” × 0.250”)
| Section | Details |
|---|---|
| Product Name | Copper (Cu) Sputtering Targets |
| Purity | 99.99% |
| Size | 3” |
| Thickness | 0.250” |
| Process Overview | Sputtering deposits thin films from various materials onto diverse substrate shapes. The process is repeatable and scalable from small R&D to medium/large production batches. Chemical reactions can occur on the target surface, in-flight, or on the substrate. Parameters allow precise control over growth and microstructure. |
| Applications | – Thin film deposition by eroding material from a target onto a substrate (e.g., silicon wafer). – Semiconductor etching requiring high anisotropy. – Analytical applications such as SIMS for composition and impurity measurement. – Space applications: space weathering affecting physical and chemical properties of airless bodies like asteroids and the Moon. |
